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BREAKDOWN VOLTAGE EVALUATION EQUIPMENT FOR SEMICONDUCTOR DEVICE, AND METHOD OF BREAKDOWN VOLTAGE SIMULATION

机译:半导体器件的击穿电压评估设备以及击穿电压仿真的方法

摘要

PROBLEM TO BE SOLVED: To provide a breakdown voltage evaluation equipment for semiconductor device and a method for breakdown voltage simulation which can make accurate estimation of the breakdown voltage of a silicon carbide power device, by performing device simulation adopting the anisotropy of breakdown strength, based on the physical considerations.;SOLUTION: The breakdown voltage evaluation equipment for semiconductor device comprises an initial value setting section which defines grid points in a designed semiconductor device and sets up designing information for each grid point; a bias-setting section for setting up the bias conditions to be applied to the semiconductor device; and a simultaneous equation calculator which solves the simultaneous equations of Poisson's equation and the continuity equation for current by using the physical property values having the anisotropy of the semiconductor device. The simultaneous equation calculator consists of a section for calculating the potential profile and the concentration profile of carriers comprising electrons and holes; a calculator of calculating the mobility vector of the carriers, based on the vector of an electric field calculated from the potential profile; and a calculator for calculating the velocity vector, which is the product of the mobility vector and the field vector, and then calculating the impact ionization factor for the carriers, based on the scalar product of the velocity vector and the field vector.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:要解决的问题:提供一种用于半导体器件的击穿电压评估设备和一种用于击穿电压仿真的方法,该方法可以通过采用击穿强度的各向异性进行器件仿真来准确估算碳化硅功率器件的击穿电压。解决方案:用于半导体器件的击穿电压评估设备包括初始值设置部分,该初始值设置部分定义被设计的半导体器件中的网格点并为每个网格点设置设计信息。偏置设置部分,用于设置要施加到半导体器件的偏置条件;以及联立方程计算器,其通过使用具有半导体装置的各向异性的物理特性值来求解电流的泊松方程和连续性方程的联立方程。联立方程计算器包括一个部分,用于计算包含电子和空穴的载流子的电势分布和浓度分布。计算器,用于根据从电位分布图计算出的电场矢量,计算载流子的迁移率矢量;计算器;用于计算速度矢量的计算机,该速度矢量是迁移率矢量与场矢量的乘积,然后基于速度矢量与场矢量的标量积来计算载流子的碰撞电离因子。 (C)2006,日本特许厅

著录项

  • 公开/公告号JP2005302772A

    专利类型

  • 公开/公告日2005-10-27

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20040112112

  • 发明设计人 HATAKEYAMA TETSUO;SHINOHE TAKASHI;

    申请日2004-04-06

  • 分类号H01L29/00;

  • 国家 JP

  • 入库时间 2022-08-21 22:35:50

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