MEASURING METHOD OF HIGH FREQUENCY CHARACTERISTIC AND HIGH FREQUENCY CHARACTERISTIC MEASURING DEVICE USED THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a method of establishing excellent electric connection for measuring high frequency characteristics of an integrated circuit.;SOLUTION: The method for measuring high frequency characteristics comprises a process of bringing the tip of a ground probe 34 into contact with a ground electrode 20 by lifting a stage 14; a process of deflecting a high frequency probe 22 into a protruded shape so as to be separated away from the surface of a wafer by lifting the stage 14 in a state of the ground probe 34 being fixed in contact to the pad 20; a process of stopping the stage 14 after the deflection of the high frequency probe 22 is released, and the tip of the ground probe 34 shaves the surface of the ground electrode 20, slides while forming a shaved surface, and stops; and a process of stopping the stage 14 after bringing a high frequency signal inputting probe 32 into contact with a high frequency signal inputting electrode 18 at predetermined contact pressure by sliding the tip of the ground probe 34 along the shaved surface to deflect the high frequency probe 22 so that the probe 22 approaches the surface of the wafer 12 by lowering the stage 14.;COPYRIGHT: (C)2005,JPO&NCIPI