CHARACTERISTIC INSPECTION DEVICE, CHARACTERISTIC INSPECTION METHOD AND CHARACTERISTIC INSPECTION PROGRAM

摘要

PROBLEM TO BE SOLVED: To perform characteristic inspection of a semiconductor device, while improving efficiency of confirmation of a contact failure of a probe.;SOLUTION: A needle mark area of the probe 4 relative to a nonstandard chip is calculated. When the needle mark area relative to the nonstandard chip is not over a specified value, it is determined that the contact state of the probe 4 is abnormal, and after exchanging a probe card 3, remeasurement relative to the chip is performed.;COPYRIGHT: (C)2005,JPO&NCIPI