PLASTIC FILM, ITS PRODUCTION METHOD, ITS PRODUCTION APPARATUS, AND FLEXIBLE CIRCUIT BOARD USING THE FILM

摘要

PROBLEM TO BE SOLVED: To inexpensively provide a flexible printed circuit board which is very firm in adhesion and capable of fine patterning by etching.;SOLUTION: After plasma treatment in a nitrogen atmosphere to make the surface roughness of a plastic film 2-5 nm, a metal comprising copper or an alloy containing copper as a main component is melted. A first thin metal film (which is) 10-100 Å in thickness is formed on the plastic film. With the use of an inert gas, the metal comprising copper or the alloy mainly containing copper is melted on the first thin metal film under plasma discharge, and a second thin metal film is vapor-deposited.;COPYRIGHT: (C)2005,JPO&NCIPI