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A METHOD OF FORMING FLEXIBLE INSULATION PROTECTION FILM OF FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD FORMED WITH FLEXIBLE INSULATION PROTECTION FILM AND PRODUCTION METHOD THEREFOR
A METHOD OF FORMING FLEXIBLE INSULATION PROTECTION FILM OF FLEXIBLE CIRCUIT BOARD AND FLEXIBLE CIRCUIT BOARD FORMED WITH FLEXIBLE INSULATION PROTECTION FILM AND PRODUCTION METHOD THEREFOR
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机译:一种形成柔性电路板的柔性绝缘保护膜的方法以及由柔性绝缘膜制成的柔性电路板及其生产方法
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摘要
A method of forming a flexible insulation protection film of a flexible circuit board, which satisfies various characteristics required for the coating materials of a flexible circuit board, and which is characterized by comprising the steps of forming, into a thermosetting resin composition film via thermosetting resin composition varnish, a thermosetting resin composition that contains an A component compound having a specified number average molecular weight and a specified functional group equivalent weight, and a B component compound having a specified number average molecular weight and a specified functional group equivalent weight, and that has an average of combined functional group equivalent weights of the A component compound and the B component compound of 300-1200 g/eq., and of pasting the thermosetting resin composition film to the flexible circuit board.
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