MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT CARD, IC TAG, RFID, TRANSPONDER, BILL, NEGOTIABLE SECURITIES, PASSPORT, ELECTRONIC APPARATUS, BAG, AND CLOTHING

摘要

PPROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device used for an ID chip which has a proper throughput and is hard to counterfeit. PSOLUTION: This method for manufacturing a semiconductor device includes a modulation circuit, a demodulation circuit, a logic circuit, a memory circuit, and an antenna circuit on an insulating board. The memory circuit is a non-volatile memory circuit. The data of the non-volatile memory circuit are written in manufacturing, and the element formation of a data section is performed by using electron beam exposure or laser exposure. For the exposure at other parts, mirror projection exposure, step-and-repeat exposure, or step-and-scan exposure are used. PCOPYRIGHT: (C)2005,JPO&NCIPI