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ELECTRONIC COMPONENT HOLDER, ITS MANUFACTURING PROCESS, AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT FROM ELECTRONIC COMPONENT HOLDER
ELECTRONIC COMPONENT HOLDER, ITS MANUFACTURING PROCESS, AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT FROM ELECTRONIC COMPONENT HOLDER
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机译:电子部件保持器,其制造过程以及从电子部件保持器中取出电子部件的方法
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摘要
PROBLEM TO BE SOLVED: To provide an electronic component holder capable of suppressing complication of arrangement or manufacturing process and eliminating possibility of cost increase or generation of a lot of wastes, and to provide its manufacturing process, and a method for removing an electronic component from the electronic component holder.;SOLUTION: The electronic component holder comprises a supporting substrate 1, and an elastic elastomer layer 3 formed on the surface of the supporting substrate 1 and tightly holding a silicon wafer W removably. A plurality of conduction passages 2 of air for partially deforming the flat surface of the elastomer layer 3 are bored through the supporting substrate 1 in the internal thickness direction.;COPYRIGHT: (C)2006,JPO&NCIPI
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