首页> 外国专利> CONTACT TYPE/NON-CONTACT TYPE HYBRID IC MODULE AND CONTACT TYPE/NON-CONTACT TYPE HYBRID IC CARD USING THE SAME

CONTACT TYPE/NON-CONTACT TYPE HYBRID IC MODULE AND CONTACT TYPE/NON-CONTACT TYPE HYBRID IC CARD USING THE SAME

机译:接触式/非接触式混合IC模块以及使用相同的接触式/非接触式混合IC卡

摘要

PPROBLEM TO BE SOLVED: To provide an inexpensive contact type/non-contact type hybrid IC card. PSOLUTION: This contact type/non-contact type hybrid IC module 10 is configured by forming a connection terminal on one face of an insulating substrate, and forming a connection pattern and a pattern connected to an antenna for a non-contact IC card incorporated at the card substrate side on the other face of the insulating substrate. A contact type IC chip and a non-contact type chip are mounted on the other face of the insulating substrate in a status that the back faces of those IC chips are adhered to each other, and they are electrically connected, and resin-sealed and completed. This contact type/non-contact type hybrid IC card is configured by incorporating an antenna coil for the non-contact IC chip in the card substrate, and exposing the antenna coil in a recess in which the contact type/non-contact type hybrid IC module of the card substrate is fit. Then, the contact type/non-contact type hybrid IC module is fit in the recess, and electrically connected and adhered. PCOPYRIGHT: (C)2005,JPO&NCIPI
机译:

要解决的问题:提供一种便宜的接触式/非接触式混合IC卡。

解决方案:通过在绝缘基板的一个表面上形成连接端子,并形成连接图案和连接至用于非接触IC的天线的图案,来构造该接触式/非接触式混合IC模块10。在绝缘基板另一面的卡基板侧并入的卡。接触型IC芯片和非接触型芯片以彼此粘附的状态安装在绝缘基板的另一面上,并且将它们电连接,树脂密封和绝缘。完成。该接触型/非接触型混合IC卡通过将用于非接触IC芯片的天线线圈并入卡基板中,并将天线线圈暴露在接触型/非接触型混合IC的凹部中而构成。卡基板的模块是否合适。然后,将接触型/非接触型混合IC模块装配在凹部中,并进行电连接和粘接。

版权:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005078101A

    专利类型

  • 公开/公告日2005-03-24

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20030209473

  • 发明设计人 MAEKAWA HIROICHI;OZAKI KATSUMI;ONO TETSUO;

    申请日2003-08-29

  • 分类号G06K19/077;B42D15/10;G06K19/07;H01L25/065;H01L25/07;H01L25/18;

  • 国家 JP

  • 入库时间 2022-08-21 22:32:16

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