CARRYING-PROCESS LAYOUT METHOD, COMPOSITE-FUNCTION ROBOT, AND CLAMPING TYPE ALIGNER DEVICE HAVING COMPLETELY HERMETIC STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a wafer carrying process unit wherein the carrying work of a robot and the notch alignment work of an aligner device can be processed concurrently.;SOLUTION: The wafer carrying process unit comprises a step for providing an aligner device in the center of a robot, steps for making a wafer movable up and down and making the wafer reversible between robot fingers and the aligner device, a step for making possible the swing of the robot fingers, a step for making possible concurrently the carrying work of the robot and the notch alignment work of the aligner device, and further a step for eliminating the mutual interference between the robot and the aligner device, and a step for preventing notches from hiding themselves even when the positions of chuck levers overlap with those of the notches.;COPYRIGHT: (C)2005,JPO&NCIPI