首页> 外国专利> PLATING DEVICE, PLATING LIQUID EVALUATION DEVICE, METHOD OF OPERATING PLATING LIQUID, AND EVALUATION METHOD FOR PLATING LIQUID

PLATING DEVICE, PLATING LIQUID EVALUATION DEVICE, METHOD OF OPERATING PLATING LIQUID, AND EVALUATION METHOD FOR PLATING LIQUID

机译:放置设备,放置液体评估设备,操作放置液体的方法以及放置液体的评估方法

摘要

PROBLEM TO BE SOLVED: To provide a plating device capable of evaluating the deteriorated condition of a plating liquid at high precision before a gold colloid caused by disproportionation reaction is produced in the liquid.;SOLUTION: The plating device is provided with: a plating treatment tank 1 to be charged with a plating liquid comprising a gold sulfite complex; a plating liquid replacement means for replacing the plating treatment tank 1 with a plating liquid; and a plating liquid analysis means 5 for sampling the plating liquid from the plating treatment tank 1 or the plating liquid replacing means and analyzing the same. The plating liquid analysis means 5 is provided with: an ultraviolet light source; a cell for securing the ultraviolet light path of the plating liquid; a measurement means for measuring the absorbing properties of ultraviolet rays including a wavelength of 220 to 240 nm; and an evaluation means for evaluating the deteriorated condition of the plating liquid from the measured absorbing properties in a wavelength of 220 to 240 nm.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种电镀装置,该电镀装置能够在液体中产生歧化反应引起的金胶体之前高精度地评估电镀液的劣化状况。槽1中装有包含亚硫酸金配合物的镀液;电镀液更换装置,用于用电镀液代替电镀处理槽1。电镀液分析装置5,用于对来自电镀处理槽1的电镀液或电镀液置换装置进行采样并进行分析。镀液分析装置5具有:紫外线光源;以及用于确保镀液的紫外线路径的单元;测量装置,其用于测量波长为220至240nm的紫外线的吸收特性; ;和一种评估装置,用于根据所测得的在220至240 nm波长处的吸收特性评估镀液的劣化状态。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP2005113239A

    专利类型

  • 公开/公告日2005-04-28

    原文格式PDF

  • 申请/专利权人 MITSUBISHI ELECTRIC CORP;

    申请/专利号JP20030351137

  • 发明设计人 FUJINO NAOHIKO;KINUGAWA MASARU;

    申请日2003-10-09

  • 分类号C25D21/14;C25D3/48;G01N21/33;

  • 国家 JP

  • 入库时间 2022-08-21 22:29:40

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