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At the heating pushing pressure head the heating pushing being the destal which is approached to the electronic parts which are overpowered
At the heating pushing pressure head the heating pushing being the destal which is approached to the electronic parts which are overpowered
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机译:在加热推动压力头处,加热推动是接近于过功率电子部件的基石
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摘要
PROBLEM TO BE SOLVED: To provide an apparatus and a method for cooling a liquid crystal panel and mounting apparatus for liquid crystal panels, when mounting IC chips on the liquid crystal panel.;SOLUTION: A liquid crystal panel cooler 201 is provided for cooling a first polarizer plate 5a with a first plate-like member 211 for heating and pressing an IC chip 2. This enables prevention of a first polarizer plate from being damaged, to result in a nonuniform display part 4 due to heat during heating and pressing of the IC chip 2. Ever if the liquid crystal panel uses a plastic board or a film liquid crystal panel, it is possible to suppress thermal damages to the plastic board or film liquid crystal panel, owing to cooling by the liquid crystal panel cooler.;COPYRIGHT: (C)2001,JPO
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