首页> 外国专利> The pushing overpowering the pushing pressure heating heater and

The pushing overpowering the pushing pressure heating heater and

机译:推压超过推压加​​热加热器

摘要

PROBLEM TO BE SOLVED: To provide a pressure heater capable of improving the yield by efficiently joining an electrode of a semiconductor bear chip to a wiring conductor of a wiring board in a short period of time by enabling the rapid rising of temperature and by reducing the variation of temperature distribution of a processing surface of the semiconductor bear chip.;SOLUTION: This pressure heater comprises with a ceramic heater for pushing and heating an object to be heated, an adiabator for mounting the ceramic heater and a base integrating these members and combining them with other members. A plurality of protruded parts are formed on the surface of the adiabator, a contact area with the ceramic heater of each protruded part is 0.5%-15% of the area of the lower surface of the ceramic heater, and the total of the areas of the parts of the protruded parts contacting with the ceramic heater is 4%-50% of the area of the lower surface of the ceramic heater.;COPYRIGHT: (C)2004,JPO
机译:解决的问题:提供一种压力加热器,该压力加热器能够通过在短时间内有效地使温度升高并降低温度来将半导体承载芯片的电极有效地接合到布线板的布线导体上,从而提高成品率。解决方案:此压力加热器包括一个陶瓷加热器,用于推动和加热要加热的物体;一个加热装置,用于安装该陶瓷加热器;以及一个将这些构件结合在一起的基座他们与其他成员。在该变径器的表面上形成有多个凸部,各凸部与陶瓷加热器的接触面积为陶瓷加热器的下表面的面积的0.5%-15%,并且,凸出部分与陶瓷加热器接触的部分占陶瓷加热器下表面面积的4%-50%。;版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP3847240B2

    专利类型

  • 公开/公告日2006-11-22

    原文格式PDF

  • 申请/专利权人 京セラ株式会社;

    申请/专利号JP20020280343

  • 发明设计人 吉田 政生;

    申请日2002-09-26

  • 分类号H05B3/20;H01L21/60;H01L21/52;

  • 国家 JP

  • 入库时间 2022-08-21 21:07:47

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号