The lead/read frame which possesses the lead/read

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device where semiconductor chips can be effectively connected to a lead frame even if the semiconductor device has a COC structure composed of an upper semiconductor chip and a lower semiconductor chip smaller than the upper semiconductor chip in external size.;SOLUTION: A semiconductor device is equipped with a lead frame provided with a die pad 10 and a lead 11; a first semiconductor chip 4 equipped with a first internal electrode 1 and a first external electrode 3 and mounted on a die pad; a second semiconductor chip 8 equipped with a second internal electrode 6 connected to the first internal electrode 1 with the bumps 2 and 5, and a second external electrode 7 and bonded to the first semiconductor chip, making its surface face the first chip; a first metal fine wire 12 and a second metal fine wire 13 which connect the lead 11 to the first and the second electrodes; and a sealing resin 14. The semiconductor chips 4 and 8 are relatively shifted while substantially keeping their edges parallel with one another, so that the edge of the semiconductor chip protrudes from the edge of the other semiconductor chip, and an external electrode is arranged on the region of the semiconductor chip which extends from the end of the other semiconductor chip.;COPYRIGHT: (C)2003,JPO