Apparatus and method using the resolution enhancement characteristics for the conversion accuracy of the chemical mechanical polishing pressure required for the force applied to the wafer by the polishing head

摘要

And methods CMP system to move relative to the retainer ring and the wafer, for CMP process A1 A polishing pad, to execute the instructions to add required pressure on the wafer. Pressure calculation, and the accuracy of the conversion to the force from the pressure is enhanced without the use of high-resolution components such as high-resolution digital device. Using the process both analog and digital, accuracy is improved in this way, the unit of the first set and also to the unit of the second set of units of the first set value of the requested power, or required pressure, It is realized by converting it to return. Quantization process is performed using the data processed by the average resolution of the digital device. In order to obtain the calculated value of the pressure and force have acceptable accuracy, a process of transmitting both the pressure / force set point data and the scale of the pressure / force between processing different devices, the process, as a result , and obtains a significantly reduced quantization error or eliminated.