Production armament of the semiconductor device, the photoresist application section which applies the photoresist of specification to pattern formation manner of the semiconductor device which utilizes this and

摘要

PROBLEM TO BE SOLVED: To provide the manufacturing facilities for semiconductor devices which form a pattern of preferred size, a pattern forming method for the semiconductor devices, and a photoresist for semiconductor manufacturing which utilize them. ;SOLUTION: Manufacturing facilities 30 are equipped with a photoresist coating part 36 which coats a wafer with specific photoresist, a development part 4 which forms a photoresist pattern on the wafer exposed after being coated with the photoresist, and a cross-linking reaction part which submits the photoresist pattern to cross-linking reaction so as to provide a stable flow in a flow process of the photoresist pattern. Furthermore, a stage for coating the wafer with the photoresist, a stage for exposing the photoresist while a photomask is arrayed, a stage for forming the photoresist pattern on the wafer, a stage for submitting the photoresist pattern to cross-linking reaction, and a stage for subjecting to flow baking of the photoresist pattern after the cross- linking reaction are included.;COPYRIGHT: (C)2000,JPO