Plasma generation method and plasma generation apparatus including inductively coupled plasma generation source

摘要

An apparatus for processing at least a surface of an article with a uniform plasma includes a processing chamber in which the article is disposed and a plasma source. The plasma source includes a dielectric plate having a first surface forming part of an inner wall of the processing chamber, and an electrical energy source, including a radiofrequency source and a substantially planar induction coil, the latter of which is disposed on a second surface of the dielectric plate, and to which energy from the radiofrequency source is preferably supplied through impedance matching circuitry. The substantially planar induction coil has at least two spiral portions which are symmetrical about at least one point of the substantially planar induction coil, and preferably forming a continuous "S-shape". The shape of the induction coil minimizes the capacitive coupling between the induction coil and the plasma, and thus the plasma sheath voltage drop, thereby improving device damage processing and plasma uniformity at the surface of the article. An impedance matching circuit connected between the substantially planar induction coil and the radiofrequency source minimizes a net voltage drop which often occurs across the leads of a prior art induction coil and thus further improves plasma uniformity at the surface of the article.