Etching the production manner of the distribution feedback die semiconductor laser component, and process and the aforementioned

摘要

PROBLEM TO BE SOLVED: To simplifiy the manufacturing process of a distributed feedback semiconductor laser element by a method wherein a laser substrate is etched to form a ridge, flattened layer is formed on the ridge to form gratings on the flattened layer, the gratings are transferred to the laser substrate formed with the ridge and the flattened layer is removed to form electrodes. ;SOLUTION: When a dry etching treatment is performed on a laser substrate 1 lamination-foamed with an etching mask 4, a ridge 5a is formed and flat semiconductor parts 5b are respectively formed on both sides of the ridge 5a in succession to the ridge 5a. A flattened layer 6 is formed on the parts 5b resists 7, which respectively have a grating, are formed on the surface of the layer 6, a dry etching treatment is performed, the gratings of the resists 7 are batch-transferred to the layer 6 and moreover, the gratings are batch- transferred to the parts 5b by a dry etching treatment, then, the layer 6 is removed. Thereby, the gratings 8 are uniformly formed to the rise part of the ridge 5a without being exerted the effect of the diffraction of light.;COPYRIGHT: (C)1998,JPO