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Vacuum processing apparatus, method for removing deposited film on inner surface of vacuum vessel in vacuum processing apparatus, and method for uniforming film deposition on inner surface of vacuum vessel in vacuum processing apparatus
Vacuum processing apparatus, method for removing deposited film on inner surface of vacuum vessel in vacuum processing apparatus, and method for uniforming film deposition on inner surface of vacuum vessel in vacuum processing apparatus
A vacuum processing system for executing processing with plasma. The system includes plasma arrival prevention magnets for forming a magnetic field along the inner face of a vacuum vessel to prevent plasma from arriving at the inner face of the vacuum vessel, and a move mechanism for relatively moving the plasma arrival prevention magnets or the vacuum vessel so as to compensate vector unevenness of the plasma arrival prevention magnets in a direction of the inner face of the vacuum vessel for uniformly depositing a thin film on the inner face. The move mechanism moves the plasma arrival prevention magnets or the vacuum vessel during the vacuum processing interim and at the etching removal of the thin film deposited on the inner face of the vacuum vessel.
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