Die bonding sheet arrival manner of arrival device and die bonding sheet

摘要

PROBLEM TO BE SOLVED: To provide a sticking device which sticks a sheet functioning as a protective sheet at the time of dicing a semiconductor chip and also functioning as an adhesive for die bonding to the rear of a wafer. SOLUTION: This die bonding sheet sticking device is equipped with a wafer carrier which takes out a wafer stored in a wafer supplier and carries it, an alignment part which positions a wafer taken out of the wafer supplier, a sheet sticker which sticks a die bonding sheet equipped with a separation sheet and a base material having a heat sensitive adhesive layer to the rear of a wafer by heating it, and a sheet separator which separates the separation sheet of the die bonding sheet from the wafer where the die bonding sheet is stuck in the sheet sticker, and this sheet sticker is equipped with a cutting means which cuts the heat sensitive adhesive base material of the die bonding sheet into the external form of the wafer before sticking the die bonding sheet to the rear of the wafer.