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Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same
Semiconductor device, cutting equipment for cutting semiconductor device, and method for cutting the same
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机译:半导体器件,用于切割半导体器件的切割设备及其切割方法
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摘要
A method for cutting a semiconductor device is provided. The device includes a first semiconductor layer, an insulation layer, and a second semiconductor layer. The method includes the steps of: forming a semiconductor part in the first semiconductor layer; irradiating a laser beam on a surface of the first semiconductor layer; and cutting the device into a semiconductor chip by using the laser beam. The laser beam is reflected at an interface so that a first reflected beam is generated, and the laser beam is reflected at another interface so that a second reflected beam is generated. The insulation film has a thickness, which is determined to weaken the first and second reflected beams each other.
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