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Removing sacrificial material by thermal decomposition
Removing sacrificial material by thermal decomposition
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机译:通过热分解去除牺牲材料
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摘要
A thermally decomposable sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The thermally decomposable sacrificial material may be removed without damaging or removing the dielectric layer. The thermally decomposable sacrificial material may be a combination of organic and inorganic materials, such as a hydrocarbon-siloxane polymer hybrid.
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