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Single poly EPROM cell having smaller size and improved data retention compatible with advanced CMOS process

机译:具有较小尺寸和改进的数据保留能力的单多晶硅EPROM单元,与先进的CMOS工艺兼容

摘要

Leakage of a single-poly EPROM cell is prevented by eliminating field oxide isolating the source, channel, and drain from the control gate n-well, and by replacing field oxide surrounding the cell with a heavily doped surface isolation region. The EPROM cell also utilizes a floating gate having an open-rectangular floating gate portion over the control gate region, and a narrow floating gate portion over the channel and intervening silicon substrate. The surface area of the open-rectangular floating gate portion ensures a high coupling ratio with the control gate region. The small width of the narrow floating gate portion prevents formation of a sizeable leakage path between the n-well and the source, channel, and drain. To conserve surface area, the EPROM cell also eliminates the p+ contact region and the PLDD region in the control gate well of the conventional EPROM design. This is permitted because the VTp implant step is masked, permitting the control gate region to operate in accumulation mode during application of 5V programming voltages.
机译:通过消除将源极,沟道和漏极与控制栅n阱隔离的场氧化层,并用重掺杂的表面隔离区域代替单元周围的场氧化层,可以防止单多晶硅EPROM单元泄漏。 EPROM单元还利用浮置栅极,该浮置栅极在控制栅极区域上方具有开口矩形的浮置栅极部分,并且在沟道和介于其间的硅衬底上方具有窄的浮置栅极部分。矩形开口的浮动栅极部分的表面积确保了与控制栅极区域的高耦合比。狭窄的浮动栅部分的小宽度防止在n阱与源极,沟道和漏极之间形成较大的泄漏路径。为了节省表面积,EPROM单元还消除了传统EPROM设计的控制栅阱中的p +接触区和PLDD区。之所以可以这样做是因为屏蔽了V Tp 注入步骤,从而允许控制栅极区域在施加5V编程电压期间以累积模式工作。

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