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Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering
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机译:具有助焊剂性能的密封剂及其在倒装芯片表面安装回流焊中的使用方法
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摘要
Encapsulated electrical component assemblies and methods of electrically connecting an electrical component having a plurality of component electrical terminations to a component carrying substrate having a plurality of substrate electrical terminations at surface mount reflow soldering conditions is described. The electrical and substrate components have an encapsulant-forming composition sandwiched therebetween and encasing said pluralities of component and substrate electrical connections. The described invention relates to using an encapsulant-forming composition comprising a thermosetting resin (preferably an epoxy resin) and a cross-linking agent (preferably an anhdride) for said resin that cross-links said resin and that also acts as a fluxing agent and optionally includes a catalyst for initiating cross-linking at required conditions. The gel point of the encapsulant-forming composition is reached after solder melt.
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