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Enhanced retention time for embedded dynamic random access memory (DRAM)

机译:延长了嵌入式动态随机存取存储器(DRAM)的保留时间

摘要

Increasing the retention time of an embedded dynamic random access memory (DRAM) is disclosed. An embedded DRAM includes a metal oxide semiconductor (MOS) capacitor. The capacitor has a storage node formed between a P+ doped region and a polysilicon plate within an N well. An N− doped region is situated substantially completely under the polysilicon plate and substantially under the P+ doped region. The presence of the N− doped region decreases the threshold voltage of the capacitor and reduces effectively the junction leakage current to the N well, achieving a larger retention time.
机译:公开了增加嵌入式动态随机存取存储器(DRAM)的保留时间。嵌入式DRAM包括金属氧化物半导体(MOS)电容器。电容器具有在N阱内的P +掺杂区和多晶硅板之间形成的存储节点。 N-掺杂区基本上完全位于多晶硅板下方,并且基本上位于P +掺杂区下方。 N-掺杂区的存在降低了电容器的阈值电压,并有效降低了流向N阱的结泄漏电流,从而实现了更长的保持时间。

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