A sensor chip assembly time delay integration circuit useful with image sensing arrays uses a duplex bucket brigade circuit (120) with two or more charge transfer paths, a number of capacitors (130, 133, 136) common to the charge transfer paths, and a number of capacitors (131, 132, 134, 135) specific to each of the charge transfer paths. Each of the charge transfer paths has a number of MOSFET transfer gates (122, 124, 126, 128; 123, 125, 127, 129) connected in series, and the common capacitors and the path-specific capacitors are alternately connected to the paths. Each of the common capacitors is controllably connected (112, 115, 118) either to a unit cell input circuit (113, 116, 119). a reset node (111, 114, 117), or an open circuit. The circuit operates by storing accumulated image sensor charges from alternate sensor lines on the path-specific capacitors. The common capacitors are reset and then connected to the unit cell input circuits to acquire a first set of image sensor charges. Charges stored on, for example, the capacitors of a particular path are then transferred to the common capacitors through transfer gates, in effect accumulating charge on the common capacitors. Then, charges are transferred from the common capacitors to the capacitors of the same particular path to again store the charges. The sequence of reset, charge acquisition, summation transfer, and storage transfer is repeated for each of the charge transfer paths.
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