ACIDIC POLISHING SLURRY FOR THE CHEMICAL-MECHANICAL POLISHING OF SIO2 ISOLATION LAYERS

摘要

An acidic polishing slurry for chemical-mechanical polishing, containing 0.1 to 5%by weight of a colloidal silica abrasive and 0.5 to 10% by weight of a fluoride salt, isdistinguished by a higher polishing selectivity with regard to the rate at which silicais removed compared to the rate at which silicon nitride is removed compared to aconventional polishing slurry containing pyrogenic silica.