Plating method for web of conductive material, used to produce flexible circuit boards, comprises laminating punched pressure sensitive adhesive web to conductive web

摘要

A pattern (21) is punched in a web (10) of pressure-sensitive adhesive material and these punched regions are removed from the web, then this web is bonded to the web (16) of conductive material and then the exposed areas of the conductive material web are plated. An independent claim is also included for the laminating machine for carrying out this method, comprising a punch (11), a laminating device and a plating device.