首页> 外国专利> Pneumatically actuated flexure gripper for wafer handling robots

Pneumatically actuated flexure gripper for wafer handling robots

机译:晶圆搬运机器人的气动弯曲夹具

摘要

The disclosure relates to a robot (10) that can transfer workpieces, such as silicon wafers, at increased speeds and accelerations and decelerations. The robot has a robot wrist (50) associated with the robot arm (42) for mechanically clamping a workpiece (302) to a workpiece handling member (60) attached to the arm. The wafer clamp selectively applies sufficient force to hold the workpiece and prevent slippage and damage to the workpiece during rapid rotation and linear movement of the handling member. In a particular embodiment, a clamp for securing silicon wafers uses a flexure assembly (93) to position and hold the wafer with minimal particle generation and wafer damage. The clamp is designed so that the wafers are normally clamped near full extension of the workpiece handling member to deliver or pick up a wafer. A particular embodiment uses a pneumatic cylinder to actuate the flexure assembly so that the flexure assembly moves outwardly and rearwardly away from the wafer when actuated at or near full extension of the workpiece handling member.
机译:本公开涉及一种机器人(10),其可以以增加的速度以及加速度和减速度来传送工件,例如硅晶片。机器人具有与机器人臂(42)相关联的机器人手腕(50),用于将工件(302)机械地夹持到附接到臂上的工件处理构件(60)。晶片夹具选择性地施加足够的力以保持工件并防止在操纵构件的快速旋转和线性运动期间滑动和损坏工件。在一特定实施例中,用于固定硅晶片的夹具使用挠曲组件(93)来定位和保持晶片,同时最小化颗粒的产生和晶片的损坏。夹具被设计成使得通常将晶片夹持在工件处理构件的完全延伸附近以输送或拾取晶片。一个特定的实施例使用气压缸来致动挠曲组件,使得挠曲组件在工件处理构件的完全延伸处或附近被完全致动时,从晶片向外和向后移动远离晶片。

著录项

  • 公开/公告号EP1041604A3

    专利类型

  • 公开/公告日2005-09-28

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号EP20000302235

  • 发明设计人 MATTHEW NED G.;SUNDAR SATISH;

    申请日2000-03-20

  • 分类号H01L21/68;

  • 国家 EP

  • 入库时间 2022-08-21 22:10:40

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