Adhesive composition for bonding different members, bonding method using the composition and composite members bonded by the bonding method

摘要

There are provided an adhesive composition for bonding two or more different members which can give a bonded material excellent in heat resistance and others with inhibiting breakage of the materials to be bonded by reducing expansion coefficient, and, besides, Young's modulus and proof stress value, a method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method. The above can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and is controlled in expansion coefficient, Young's modulus and proof stress value.