Power semiconductor module with scalable structural-design technology

摘要

The module (10) has a base plate (20) or is for direct mounting on a cooling body consisting of a frame-like housing (30), a cover, outward-leading connection elements and at least two insulating substrates (50) in the housing, each with an insulating body (52), connecting tracks (54) on a main surface facing the base plate and connected power semiconducting components (56), whereby all substrates are identical, are electrically connected, have the same number and type of components and have a sensor component (58) and associated conducting track(s) (54b).