Power semiconductor module with scalable structural-design technology

摘要

the invention describes a leistungshalbleitermodul (10) with a base plate in a scalable can (20) or for direct mounting on a heat sink comprising a rahmenartigen housing (30), a lid to the outside leading connecting for lastkontakte (40,42,44) and auxiliary contacts and at least two inside the housing (30) arranged electrically insulating substrates (50).the substrates comprise a isolierstoffku00f6rper (52), and a base plate (20) on which the first principal surface of the heat sink away most of each other electrically isolated metal verbindungsbahnen (54), and which of these ca rbindungsbahnen schaltungsgerecht associated leistungshalbleiterbauelementen (56).all the substrates (50) are fully identical shape. all the substrates (50) are electrically connected with each other and to all the substrates (50) is of the same type and number of leistungshalbleiterbauelementen (56) is arranged.