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METHOD OF STANDARDIZING DESIGNS AND PROCESSES FOR THICK FILM RESISTOR AND REALIZING INTEGRATED SYSTEM BETWEEN DESIGNS AND ACTUAL PROCESSES
METHOD OF STANDARDIZING DESIGNS AND PROCESSES FOR THICK FILM RESISTOR AND REALIZING INTEGRATED SYSTEM BETWEEN DESIGNS AND ACTUAL PROCESSES
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机译:标准化厚膜电阻器的设计和过程的方法,以及实现设计与实际过程之间的集成系统的方法
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摘要
PURPOSE: A method is provided to standardize designs and processes for the resistor and to realize an integrated system between the designs and actual processes by reflecting errors between the designs and actual processes on design formulas of the resistor. CONSTITUTION: Basic formulas for defining relations among the resistance value of a resistor, the size, the aspect ratio, and the resistivity of resistive paste are determined. A plurality of resistor patterns with different sizes are arbitrarily designed according to the basic formulas and the size and resistance value of each resistor pattern are stored(S10). A real resistor pattern with the same size as each arbitrarily designed resistor pattern is manufactured and fired(S20). A real resistance value is measured from the fired resistor pattern(S30). The deviation between the real resistance value and the designed resistance value is obtained and an error correcting coefficient is set according to the deviation(S40,S50). The error correcting coefficient is added to the basic formulas and a predetermined design formula of a thick film resistor is obtained by determining an operational relation(S60). A size of a desired thick film resistor is obtained by substituting parameters of the resistor for the design formulas and outputted(S70,S80,S90).
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