METHOD OF FORMING DIELECTRIC FILM USING ALTERNATELY DIELECTRIC FILM DEPOSITION AND HEAT TREATMENT

摘要

Purpose: a kind of method being used to form a dielectric film, which is arranged to reduce leakage current, obtains dielectric film, and a required thickness alternately uses a dielectric film deposition and heat treatment. Construction: the first dielectric film is formed in a predetermined layer. It heats to treat and is performed on it for the first time. One auxiliary queue film is formed in the first heat treated dielectric film. One secondary heat treatment is performed on it. Heat treatments are executed under a predetermined gas atmosphere or under a vacuum condition. Predetermined gas is one selected from one group comprising O2, O3, N2, Ar, He, O2 plasma and NH3 plasmas.