FILM BULK ACOUSTIC RESONATOR HAVING SUPPORT MEMBER FORMING AIR GAP BETWEEN PIEZOELECTRIC RESONATOR STRUCTURE AND SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A film bulk acoustic resonator having a support member and a manufacturing method thereof are provided to reduce a substrate loss by forming an air gap between a piezoelectric resonator structure and a substrate. CONSTITUTION: A film bulk acoustic resonator having a support member includes a semiconductor substrate(401), a signal line(402) formed on the semiconductor substrate, a piezoelectric resonator structure, and at least one support members(404). The piezoelectric resonator structure is spaced with a predetermined height from the semiconductor substrate and is formed by attaching a metal film used for electrodes on upper and lower portion of a piezoelectric film. The at least one support members support the piezoelectric resonator structure from the semiconductor substrate.