ETCHING PROCESSING METHOD AND ETCHING PROCESSING APPARATUS OF A SUBSTRATE WITHOUT A LARGE-SIZED PROCESSING CONTAINER CORRESPONDING TO A LARGE-SIZED SUBSTRATE

摘要

PURPOSE: An etching processing method and an etching processing apparatus of a substrate are provided to etch a metal film formed on the surface of the substrate as a predetermined pattern by supplying etching solution with the surface of the substrate so that a large-sized processing container corresponding to a large-sized substrate does not required, thereby capable of inhibiting the increase of usage in the etching solution. CONSTITUTION: A substrate carrier device for supporting and carrying the substrate(W) is mounted to the inside of the first processing container(14). The substrate carrier device has plural carrier rollers(20) arrayed parallel to each other. A spray nozzle(22) is mounted upwardly to a substrate carrier path of the substrate carrier device so that etching solution is injected to the surface of the substrate carried by the substrate carrier device. The second processing container(28) is connected to the first processing container. Plural carrier rollers(30) capable of rotating forwardly and backwardly are arrayed in parallel along the substrate carrier path to the inside of the second processing container. An injection nozzle(32) has an injection opening with a slit type is mounted to the very upper position of the substrate carrier path.