首页> 外国专利> METHOD OF FABRICATING SUBSTANTIALLY RELAXED, HIGH-QUALITY SiGe CRYSTAL LAYER OVER INSULATING LAYER BY COMBINING ASPECTS OF SILICON-ON-INSULATOR FORMATION WITH INTER-DIFFUSION OF Ge-CONTAINING LAYER

METHOD OF FABRICATING SUBSTANTIALLY RELAXED, HIGH-QUALITY SiGe CRYSTAL LAYER OVER INSULATING LAYER BY COMBINING ASPECTS OF SILICON-ON-INSULATOR FORMATION WITH INTER-DIFFUSION OF Ge-CONTAINING LAYER

机译:通过将绝缘体上硅形成层与含锗层间扩散相结合的方法,在绝缘层上制造基本上弛豫的高质量SiGe晶体层

摘要

A method of forming a substantially relaxed, high-quality SiGe-on-insulator substrate material using SIMOX and Ge interdiffusion is provided. The method includes first implanting ions into a Si-containing substrate to form an implant rich region in the Si-containing substrate. The implant rich region has a sufficient ion concentration such that during a subsequent anneal at high temperatures a barrier layer that is resistant to Ge diffusion is formed. Next, a Ge-containing layer is formed on a surface of the Si-containing substrate, and thereafter a heating step is performed at a temperature which permits formation of the barrier layer and interdiffusion of Ge thereby forming a substantially relaxed, single crystal SiGe layer atop the barrier layer.
机译:提供了一种使用SIMOX和Ge互扩散形成基本松弛的高质量绝缘体上SiGe衬底材料的方法。该方法包括首先将离子注入到含硅衬底中,以在含硅衬底中形成富注入区。富含注入物的区域具有足够的离子浓度,使得在随后的高温退火期间,形成了抵抗Ge扩散的阻挡层。接下来,在含Si衬底的表面上形成含Ge层,然后在允许形成阻挡层和Ge相互扩散的温度下执行加热步骤,从而形成基本上松弛的单晶SiGe层。在阻挡层上。

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