首页> 外国专利> HEAT TREATMENT APPARATUS AND METHOD FOR INCRESING QUICKLY SUBSTRATE TEMPERATURE TO AIMING TEMPERATURE AND IMPROVING INPLANE TEMPERATURE UNIFORMITY OF SUBSTRATE

HEAT TREATMENT APPARATUS AND METHOD FOR INCRESING QUICKLY SUBSTRATE TEMPERATURE TO AIMING TEMPERATURE AND IMPROVING INPLANE TEMPERATURE UNIFORMITY OF SUBSTRATE

机译:提高基体温度以达到目标温度并改善基体平面温度均匀性的热处理设备和方法

摘要

PURPOSE: A heat treatment apparatus and method are provided to increase quickly a substrate temperature to an aiming temperature and to achieve the uniformity of the substrate temperature. CONSTITUTION: A heat treatment apparatus includes a heat plate(3) with heaters(32) for loading a substrate(G), a first controller, a non-contact thermometer, a temperature difference measuring part, a memory part, a correcting part. The first controller(64) is used for controlling the substrate to be heated according to a pre-setting temperature rising pattern. The non-contact thermometer(4) measures the substrate temperature. The temperature difference measuring part(63) measures the difference between the measured temperature of the thermometer and an aiming temperature of the substrate. The memory part(62) stores data corresponding to the temperature difference, the measured temperature or a loading time of the substrate, and a correcting amount of power supply. The correcting part is used for correcting temperature of the substrate according to the data.
机译:目的:提供一种热处理设备和方法,以将衬底温度快速升高至目标温度并实现衬底温度的均匀性。组成:一种热处理设备,包括带有用于装载基板(G)的加热器(32)的加热板(3),第一控制器,非接触温度计,温度差测量部件,存储部件,校正部件。第一控制器(64)用于根据预设的温度升高模式控制待加热的基板。非接触式温度计(4)测量基材温度。温度差测量部(63)测量温度计的测量温度与基板的目标温度之间的差。存储器部分(62)存储与温度差,所测量的基板的温度或装载时间以及校正的电源量相对应的数据。校正部分用于根据数据校正基板的温度。

著录项

  • 公开/公告号KR20040108537A

    专利类型

  • 公开/公告日2004-12-24

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LIMITED;

    申请/专利号KR20040018865

  • 发明设计人 SATA NOBUYUKI;

    申请日2004-03-19

  • 分类号H01L21/027;

  • 国家 KR

  • 入库时间 2022-08-21 22:06:21

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