WET ETCHING APPARATUS FOR EXTENDING ETCHING SOLUTION SPRAY AREA AND IMPROVING ETCHING UNIFORMITY

摘要

PURPOSE: A wet etching apparatus is provided to uniformly spray an etching solution to a substrate with a high pressure using relatively small number of high-pressure spray nozzles to extend an etching solution spray area and improve etching uniformity. CONSTITUTION: A wet etching apparatus includes a chemical bath(20), a nozzle bar(30) placed above the chemical bath, a plurality of high-pressure spray nozzles(40), and a porous plate. The nozzle bar supplies an etching solution. The high-pressure spray nozzles are connected to the nozzle bar. Each of the spray nozzles includes an etching solution inflow hole through which the etching solution is introduced from the nozzle bar and an etching solution spray hole(44) through which the etching solution is sprayed. The porous plate is placed at the etching solution spray hole of each spray nozzle and has a plurality of spray holes through which the etching solution is sprayed on a substrate(60) uniformly and widely.