首页> 外国专利> APPARATUS AND METHOD OF TREATING EDGE OF SEMICONDUCTOR SUBSTRATE FOR PREVENTING BRIDGE BETWEEN TRANSISTORS BY REMOVING RESIDUAL PARTICLES FROM EDGE OF SEMICONDUCTOR SUBSTRATE

APPARATUS AND METHOD OF TREATING EDGE OF SEMICONDUCTOR SUBSTRATE FOR PREVENTING BRIDGE BETWEEN TRANSISTORS BY REMOVING RESIDUAL PARTICLES FROM EDGE OF SEMICONDUCTOR SUBSTRATE

机译:处理半导体基板边缘的装置和方法,用于通过从半导体基板边缘去除残留颗粒来防止晶体管之间的桥接

摘要

PURPOSE: An apparatus and a method of treating an edge of a semiconductor substrate are provided to prevent a bridge between transistors by removing residual particles from the edge of the semiconductor substrate. CONSTITUTION: A semiconductor substrate is loaded on a supporting part. A protection cover(200) is used for preventing the inflow of fluid into a protection side of the semiconductor substrate. The protection cover moves up and down. A chemical supply nozzle is used for supplying a first chemical to an edge of the semiconductor substrate. A cleaning unit(500) cleans the edge of the semiconductor substrate.
机译:目的:提供一种处理半导体衬底的边缘的装置和方法,以通过从半导体衬底的边缘去除残留的颗粒来防止晶体管之间的桥接。构成:半导体衬底被装载在支撑部分上。保护盖(200)用于防止流体流入半导体衬底的保护侧。保护盖上下移动。化学药品供应喷嘴用于将第一化学药品供应到半导体衬底的边缘。清洁单元(500)清洁半导体衬底的边缘。

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