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APPARATUS AND METHOD OF TREATING EDGE OF SEMICONDUCTOR SUBSTRATE FOR PREVENTING BRIDGE BETWEEN TRANSISTORS BY REMOVING RESIDUAL PARTICLES FROM EDGE OF SEMICONDUCTOR SUBSTRATE
APPARATUS AND METHOD OF TREATING EDGE OF SEMICONDUCTOR SUBSTRATE FOR PREVENTING BRIDGE BETWEEN TRANSISTORS BY REMOVING RESIDUAL PARTICLES FROM EDGE OF SEMICONDUCTOR SUBSTRATE
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机译:处理半导体基板边缘的装置和方法,用于通过从半导体基板边缘去除残留颗粒来防止晶体管之间的桥接
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摘要
PURPOSE: An apparatus and a method of treating an edge of a semiconductor substrate are provided to prevent a bridge between transistors by removing residual particles from the edge of the semiconductor substrate. CONSTITUTION: A semiconductor substrate is loaded on a supporting part. A protection cover(200) is used for preventing the inflow of fluid into a protection side of the semiconductor substrate. The protection cover moves up and down. A chemical supply nozzle is used for supplying a first chemical to an edge of the semiconductor substrate. A cleaning unit(500) cleans the edge of the semiconductor substrate.
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