APPARATUS FOR REMOVING UNNECESSARY OBJECT FROM PERIPHERAL EDGE OF SUBSTRATE, SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR REMOVING UNNECESSARY OBJECT FROM PERIPHERAL EDGE OF SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To efficiently remove an unnecessary object stuck to a peripheral edge of a wafer in a wafer process.;SOLUTION: The wafer 20 is placed on a substrate stage 31 in a chamber 30. Helium gas is led from a feed port 38a of a pipe 38 into the chamber 30 to generate helium gas plasma P1 by a plasma generation means. Then chlorine gas is led from a processing gas feeding nozzle 33 to generate chlorine gas plasma P2. The concentration of chlorine gas around the peripheral edge of the wafer 20 is controlled to a high concentration by controlling an exhaust speed of an exhausting apparatus and the peripheral edge of the wafer 20 is covered with the chlorine gas plasma P2 to etch and remove the unnecessary object stuck thereon.;COPYRIGHT: (C)2008,JPO&INPIT