CMP POLISHING HEAD SAVING RETAINING RING COST AND MEMBRANE COST USING AIR BAG AND OPERATING METHOD THEREOF

摘要

PURPOSE: A CMP polishing head and an operating method thereof are provided to save the retaining ring cost and the membrane cost by polishing a wafer under the down force of an air bag catching the wafer by vacuum. CONSTITUTION: A first head(21) connected with a rotating shaft(20) is rotated under the down force. A second head(23) formed at the lower side of the first head is rotated together with the first head. An air bag(22) delivering the down force of the first head to the second head is formed between the first head and the second head. A multitude of wafer hold cells delivering the down force to a wafer(26) caught by vacuum are connected with the lower side of the second head.