METHOD FOR MANUFACTURING SUBSTRATE HAVING ATTACHED RESIST FILM, PARTICULARLY REGARDING TO IMPROVING UNIFORMITY OF THICKNESS OF RESIST FILM

摘要

PURPOSE: A method for manufacturing a substrate having an attached resist film is provided to improve uniformity of thickness of the resist film by forming an applied film having small film thickness distribution. CONSTITUTION: A resist agent(21) is contacted to a surface(10a) to be applied, through an upper end of an applying nozzle(22). A gap(G) between the applying nozzle and the surface to be applied is 50% or more of a separation solution gap within a range of the separation solution gap separating the resist agent from the surface to be applied.