首页> 外国专利> METHOD OF FORMING SILICIDE LAYER OF SEMICONDUCTOR DEVICE TO PREVENT LOSS OF ACTIVE REGION AND FIELD REGION IN SILICIDE LAYER REGION

METHOD OF FORMING SILICIDE LAYER OF SEMICONDUCTOR DEVICE TO PREVENT LOSS OF ACTIVE REGION AND FIELD REGION IN SILICIDE LAYER REGION

机译:形成半导体器件的硅化物层以防止硅化物层区域中的有源区和场区损失的方法

摘要

PURPOSE: A method of forming a silicide layer of a semiconductor device is provided to prevent loss of an active region and a field region by forming a protective layer on a silicide layer region. CONSTITUTION: A semiconductor substrate(10) including a silicide blocking region(A) and a silicide region(B) is provided. Gate electrodes(18a,18b) and source/drain junction regions(30a,30b) are formed on the silicide blocking region and the silicide region. A protective layer is deposited along a step of the entire surface of the semiconductor substrate. A photoresist pattern is formed to cover an active region of the silicide blocking region. The protective layer of the silicide region is patterned by performing an etch process using the photoresist pattern as an etch mask. A PAI process is performed on the silicide region by using the remaining protective layer as a screen mask. The remaining protective layer is removed by a cleaning process. A silicide layer is formed on the silicide region.
机译:目的:提供一种形成半导体器件的硅化物层的方法,以通过在硅化物层区域上形成保护层来防止有源区和场区的损失。构成:提供一种半导体衬底(10),其包括硅化物阻挡区(A)和硅化物区(B)。在硅化物阻挡区和硅化物区上形成栅电极(18a,18b)和源/漏结区(30a,30b)。沿着半导体衬底的整个表面的台阶沉积保护层。形成光致抗蚀剂图案以覆盖硅化物阻挡区的有源区。通过使用光致抗蚀剂图案作为蚀刻掩模执行蚀刻工艺来图案化硅化物区域的保护层。通过使用剩余的保护层作为屏幕掩模,对硅化物区域执行PAI工艺。剩余的保护层通过清洁工艺去除。在硅化物区域上形成硅化物层。

著录项

  • 公开/公告号KR20050010239A

    专利类型

  • 公开/公告日2005-01-27

    原文格式PDF

  • 申请/专利权人 MAGNACHIP SEMICONDUCTOR LTD.;

    申请/专利号KR20030049256

  • 发明设计人 PARK KUN JOO;

    申请日2003-07-18

  • 分类号H01L21/28;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:57

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