APPARATUS AND METHOD OF INSPECTING POLISHED SURFACE OF SEMICONDUCTOR WAFER FOR MANUFACTURING EXACTLY QUICKLY DESIRED SAMPLE WAFER USING COMPARISON OF CONTRAST IN PHOTOGRAPHED IMAGE WITH THAT IN STORED IMAGE

摘要

PURPOSE: An apparatus and method of inspecting a polished surface of a semiconductor wafer are provided to manufacture exactly quickly a desired sample wafer by performing a comparison of contrast in a photographed image with that in a stored image using a controller. CONSTITUTION: An apparatus includes a polishing part, a wafer holding part, a camera and a controller. The polishing part is connected to a vertical support part(1) to polish a semiconductor wafer(W). The wafer holding part rotates the wafer. The camera is used for photographing a polished surface of the wafer. The controller(C) inspects the thickness of the polished surface by comparing the image transmitted from the camera with a stored image.