Semiconductor wafer's defect inspecting apparatus, has data processing unit comparing set of images with other set of images of surface of wafer previously acquired by sensors, and automatically detecting defect based on image comparison

摘要

The apparatus has a set of light sensors (2A-2C) i.e. charge coupled device (CCD) camera, relatively arranged, so that the light sensors acquire a set of images from different angles of view of a surface of a wafer supported on a platform. A data processing unit (10) is connected to the light sensors, and receives data representative of the images acquired by the light sensors. The data processing unit compares the set of images with other set of images of a surface of another wafer previously acquired by the light sensors, and automatically detects a defect based on the image comparison. An independent claim is also included for a method for detecting a defect on a semiconductor wafer.