ELECTROLYTE USED WHEN SELECTIVELY DEPOSITING TIN OR TIN ALLOY FILM ON COMPOSITE SUBSTRATE AND METHOD FOR DEPOSITING TIN OR TIN ALLOY ON COMPOSITE SUBSTRATE

摘要

PURPOSE: To provide a composition and a method for selectively electroplating tin or tin alloy on a composite substrate comprising a metal part and a ceramic part without reduction of adhesive force between the metal part and the ceramic part, wherein the composition contains constituents that do not damage adhesive force on a boundary surface of metal and ceramic. CONSTITUTION: A method for electroplating a composite substrate comprises a step of contacting the composite substrate with a composition comprising one or more tin or tin alloy sources selected from stannous organic sulfonate, stannous sulfate, stannous gluconate, stannous citrate, stannous lactate and stannous halide, one or more aromatic diols, at least one surfactant that is an alcohol ethoxylate, and one or more compounds, salts thereof or ester thereof having an amount of 15 to 55 gm/L represented as the following general formula: HOOCBCOOH where B is chemical bond or (-CH2-)n, and n is an integer of 1 to 4; and selectively depositing tin or tin alloy on a metal part on the composite substrate by generating an electric current in the composition.