首页> 外国专利> THERMISTOR BARE CHIP CAPABLE OF PREVENTING SURFACE FROM BEING OXIDIZED BY EXPOSING GOLD LAYERS OUTSIDE, AND METHOD FOR MANUFACTURING THE SAME

THERMISTOR BARE CHIP CAPABLE OF PREVENTING SURFACE FROM BEING OXIDIZED BY EXPOSING GOLD LAYERS OUTSIDE, AND METHOD FOR MANUFACTURING THE SAME

机译:能够通过暴露在外的金层来防止表面氧化的热敏裸片及其制造方法

摘要

PURPOSE: A thermistor bare chip and a method for manufacturing the same are provided to prevent an oxidation of the surface of an electrode by exposing gold layers of the electrode outside, and reduce manufacturing costs by making the gold layers thin and silver layers thick. CONSTITUTION: A thermistor bare chip comprises a ceramic body(10); and an electrode constituted by silver layers(20) and gold layers(30). The silver layers are printed at respective printed ends of the ceramic body, and the gold layers are deposited on the respective silver layers through a deposition process. A method for manufacturing the thermistor bare chip comprises a step of printing a silver paste on both ends of the ceramic body; a step of evaporating a solvent by drying the ceramic body printed with the silver paste; a step of forming silver layers by baking the ceramic body; and a step of depositing gold on the silver layers.
机译:目的:提供一种热敏电阻裸芯片及其制造方法,以通过将电极的金层暴露在外部来防止电极表面的氧化,并通过使金层变薄和银层变厚来降低制造成本。组成:热敏电阻裸芯片包括一个陶瓷体(10);电极由银层(20)和金层(30)构成。银层印刷在陶瓷体的各个印刷端,并且金层通过沉积工艺沉积在各个银层上。一种热敏电阻裸芯片的制造方法,包括在陶瓷体的两端上印刷银膏的步骤;通过干燥印刷有银浆的陶瓷体来蒸发溶剂的步骤;通过烘烤陶瓷体形成银层的步骤;以及在银层上沉积金的步骤。

著录项

  • 公开/公告号KR20050019996A

    专利类型

  • 公开/公告日2005-03-04

    原文格式PDF

  • 申请/专利权人 JOINSET CO. LTD.;

    申请/专利号KR20030057613

  • 发明设计人 KIM SUN KI;

    申请日2003-08-20

  • 分类号H01C17/00;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:45

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