METHOD FOR MANUFACTURING IC CARD EQUIPPED WITH IC CHIP AND IC CARD THEREOF

摘要

PURPOSE: A method for manufacturing an IC card equipped with an IC chip and the IC card thereof are provided to secure reliability by simplifying a manufacturing process and entirely forming a symmetric structure, while preventing breakage of a part contacted between the IC chip and a coil. CONSTITUTION: An upper and a lower plate(30,20) are an outer layer of the IC card equipped with the IC chip(40). A soft plate(10) is placed between the upper and the lower plate, is formed with a material relatively thicker and softer than the upper/lower plate, and has an IC insertion hole(11) to receive the IC chip. The coil(13) formed to one side of the soft plate is formed in the structure that the part contacting with terminals(41,41') of the IC chip is partially buried in the soft plate. In the state that the contacted part is buried in the soft plate, the coil is electrically connected to the terminals of the IC chip.