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SEMICONDUCTOR DEVICE HAVING WELL STRUCTURE FOR IMPROVING SOFT ERROR RATE IMMUNITY AND LATCH-UP IMMUNITY AND FABRICATION THE SAME

机译:具有改善软错误率抗扰性和闩锁抗扰性并制造相同结构的半导体器件

摘要

A semiconductor device with improved soft error rate immunity and latch-up immunity and a method of forming the same. The device includes first wells of first conductivity type and second well of second conductivity type formed in the semiconductor substrate of first conductivity type. First conductivity type MOSFETs including source/drain of first conductivity type are formed in the second well, and second conductivity type MOSFETs including source/drain of second conductivity type in the first well. A third well of second conductivity type is formed at a region under the first wells and the drain of the second conductivity type MOSFETs. The first well is connected to the semiconductor substrate between the first well and the third well.
机译:具有改善的软错误率抗扰度和闩锁抗扰度的半导体器件及其形成方法。该器件包括在第一导电类型的半导体衬底中形成的第一导电类型的第一阱和第二导电类型的第二阱。在第二阱中形成包括第一导电类型的源极/漏极的第一导电类型的MOSFET,并且在第一阱中包括第二导电类型的源极/漏极的第二导电类型的MOSFET。第二导电类型的第三阱形成在第二导电类型的MOSFET的第一阱和漏极下方的区域。第一阱在第一阱和第三阱之间连接到半导体衬底。

著录项

  • 公开/公告号KR20050034401A

    专利类型

  • 公开/公告日2005-04-14

    原文格式PDF

  • 申请/专利权人 SAMSUNG ELECTRONICS CO. LTD.;

    申请/专利号KR20030070310

  • 发明设计人 JUNG HYUCK CHAI;

    申请日2003-10-09

  • 分类号H01L27/092;

  • 国家 KR

  • 入库时间 2022-08-21 22:05:34

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