Beam lead bonding device for microBGA (microballgridarray) and its bonding method

摘要

According to the present invention, a plurality of bonding portions are provided in a bonding head so as to correspond to bonding pads of a semiconductor chip, respectively, and beam bonds of the substrate strip and bonding pads of the semiconductor chip are simultaneously bonded. A beam lead bonding apparatus for a micro ball grid array (BGA) and a bonding method thereof for improving productivity and reliability of beam lead bonding.;An object of the present invention is to reduce the X, Y, Z axis movement error of the bonding portion to secure the beam lead bonding of the micro BGA, and to shorten the time of the beam lead bonding to improve productivity by the micro BGA beam lead bonding apparatus And a bonding method thereof.;In order to achieve the above object, a beam lead bonding apparatus and a bonding method for a micro BGA according to the present invention provide a bonding head with a number of bonding portions corresponding to bonding pads of a semiconductor chip in the bonding head, thereby forming the bonding head in the X, Y, and Z axes. The beam lead is bonded to the beam leads of the substrate strip and the bonding pads of the semiconductor chip at the same time with minimum movement. Therefore, the present invention reduces the moving error of the bonding unit to improve the reliability of bonding properties and shorten the bonding time to improve productivity.